InGaAs/InP quantum well infrared photodetector integrated on Si substrate by Mo/Au metal-assisted wafer bonding

Integration of an InGaAs/InP quantum well infrared photodetector (QWIP) onto a Si substrate was successfully demonstrated via a metal-assisted wafer bonding (MWB) using a Mo/Au metal scheme. The Mo/Au/Mo layer, situated between the QWIP structure and the Si, has shown a well-ordered lamination. It provides a smooth surface with a roughness of about 0.8 nm, as measured by a scanning electron microscope (SEM) and atomic force microscopy (AFM). The results on crystalline quality evaluated by Raman spectroscopy and X-ray diffraction (XRD) imply that the MWB could be achieved without any measurable material degradation and residual strain. 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